I NTEGRATED C IRCUITS D IVISION
CPC1965G
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020 , in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033 .
Device
CPC1965G
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive , and should be handled according to the industry standard JESD-625 .
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
CPC1965G
Maximum Temperature x Time
245oC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
R07
www.ixysic.com
5
相关PDF资料
CPC1965Y RELAY SSR 1A 8-SIP
CPC1966Y RELAY SSR AC POWER SWITCH 4SIP
CPC1967J RELAY 400VAC/DC 1.35A I4-PAC
CPC1972GS SWITCH POWER 250MA 800VAC 6-SMT
CPC1976Y RELAY 600VAC 2A POWER 8-SIP
CPC1977J RELAY OPTOMOS 1.25A SP-NO I4-PAC
CPC1978J RELAY OPTOMOS 750MA SP-NO I4-PAC
CPC1979J RELAY 600V 1.4A ISOPLUS264
相关代理商/技术参数
CPC1965G_1 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:AC Solid State Relay
CPC1965G_11 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:AC Solid State Relay
CPC1965Y 功能描述:三极与 SCR 输出光电耦合器 AC Switch RoHS:否 制造商:Vishay Semiconductors 输出设备:PhotoTriac 每芯片的通道数量: 绝缘电压:3750 Vrms 正向电流:10 mA 正向电压:1.2 V 最大触发电流:10 mA 关断状态下输出电压-VDRM:600 V 最大连续输出电流: 零交叉电路: 封装:Reel
CPC1965Y_1 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:AC Solid State Relay
CPC1965Y_11 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:AC Solid State Relay
CPC1966 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:AC Power Switch
CPC1966B 功能描述:固态继电器-PCB安装 8-Pin Power SOIC RoHS:否 制造商:Omron Electronics 控制电压范围: 负载电压额定值:40 V 负载电流额定值:120 mA 触点形式:1 Form A (SPST-NO) 输出设备:MOSFET 封装 / 箱体:USOP-4 安装风格:SMD/SMT
CPC1966Y 功能描述:RELAY SSR AC POWER SWITCH 4SIP RoHS:是 类别:继电器 >> 固态 系列:CPC 标准包装:100 系列:G3VM 电路:SPST-NO(1 Form A) 输出类型:AC,DC 导通状态电阻:60 毫欧 负载电流:3.5A 输入电压:1.33VDC 电压 - 负载:0 ~ 40 V 安装类型:通孔 端接类型:PC 引脚 封装/外壳:6-DIP(0.300",7.62mm) 供应商设备封装:6-DIP 包装:管件 继电器类型:继电器 其它名称:Z3518